Integrated Signal and Power Integrity Co-Simulator for Printed Circuit Board Offered

E-System Design Unveils Integrated Signal and Power Integrity Co-Simulator for IC Packaging, Printed Circuit Board and Logic

ATLANTA----E-System Design, Inc. today unveiled a breakthrough solution that provides organisation engineers with superior visibility and predictability when simulating IC packaging and printed circuit board performance by allowing designers to accurately simulate critical paths up to complete designs for signoff before they are released to manufacturing.